A 1.2 x 0.25 inch x 0.031 inch thick (30 x 6 x 0.75 mm) PCB for demonstrating 1.1 x 1.1 mm DFN4/ULLGA sensors (-14E sensor suffix; order sensors separately).
Note that since these boards use very small sensors, they require reflow or hot-air soldering techniques.
The AG919-06 is a 2 x 0.25 inch (50 x 6 mm) PCB designed to be used with MSOP8 sensors (-00E package; order sensors separately). The MSOP8 is rotated 90 degrees compared to the AG918-06.
The AG954-07E provides a socket for easy programming and prototyping of TDFN6 devices without soldering and unsoldering.
The custom socket is compatible with NVE's 2.5 mm x 2.5 mm TDFN6 package parts (-10E suffixes).
The board is 1.5" x 2" (38 mm x 50 mm), and uses brass hardware to minimize magnetic interference with the socketed sensor.
A 0.1"-spaced header provides for connections to the sensors, and a row of 0.1"-spaced through-holes allows for auxiliary parts such as a decoupling capacitor or an LED.
The AG957-06E provides easy connections to an ASR-Series Smart Angle Sensor (sensors sold separately). In addition a spot for the sensor, the board has a spot for a bypass capacitor and a header to connected to the sensor I/O pads.
The board is approximately 0.5 by 0.6 inches (12 x 15 mm).